College Code REAP: 1031, RMAP: 302
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REAP-2022 Reporting Instructions
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Course Outcomes:

After completion of this course, students will be able to –

2MVL2-16.1

Introduce the process involved in semiconductor manufacturing and fabrication.

2MVL2-16.2

Model the oxidation growth rate & to understand oxidation process and the process ofdiffusion and to expound the Ion Implantation process.

2MVL2-16.3

Explain the thin film deposition process, etching process packaging and chip mountingtechnique Process Integration.

2MVL2-16.4

Packaging and assembly of protective encapsulating materials with wire bonding

 

CO-PO/PSO Mapping Matrix

COs

PO 1

PO 2

PO 3

PSO 1

PSO 2

2MVL2-16.1

 

3

 

2

 

1

 

3

 

1

2MVL2-16.2

 

1

 

2

 

2

 

2

 

     2

2MVL2-16.3

 

3

 

2

 

1

 

2

 

1

2MVL2-16.4

 

2

 

1

 

2

 

1

 

2

2MVL2-16

2

2

1

2

1

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