Course Outcomes:
After completion of this course, students will be able to –
2MVL2-16.1 |
Introduce the process involved in semiconductor manufacturing and fabrication. |
2MVL2-16.2 |
Model the oxidation growth rate & to understand oxidation process and the process ofdiffusion and to expound the Ion Implantation process. |
2MVL2-16.3 |
Explain the thin film deposition process, etching process packaging and chip mountingtechnique Process Integration. |
2MVL2-16.4 |
Packaging and assembly of protective encapsulating materials with wire bonding
|
CO-PO/PSO Mapping Matrix
COs |
PO 1 |
PO 2 |
PO 3 |
PSO 1 |
PSO 2 |
2MVL2-16.1 |
3 |
2 |
1 |
3 |
1 |
2MVL2-16.2 |
1 |
2 |
2 |
2 |
2 |
2MVL2-16.3 |
3 |
2 |
1 |
2 |
1 |
2MVL2-16.4 |
2 |
1 |
2 |
1 |
2 |
2MVL2-16 |
2 |
2 |
1 |
2 |
1 |